SURFCON® / SURFACE ENGINEERING
Inspired by gecko adhesion.
Refined for precision wafer handling.
Proprietary polymers and microstructures
balance lateral grip with low vertical tack.
Hold during transfer. Release during lift-off.
Microstructured contact surfaces provide lateral resistance to support stable wafer transfer.
Low vertical tack supports smooth separation, helping reduce sticking and popping during release.
Conceptual illustrations · Not to scale.
Grip and tack depend on the selected model, contact surface and operating conditions.
FROM MATERIAL TO MICROSTRUCTURE
Proprietary POLMA® and CONEPOL® formulations provide the material foundation for SurfCon®.
Purity · Chemical resistance · Conductive options
Engineered surface patterns tune contact behavior to balance lateral grip with vertical release.
Pattern geometry · Contact behavior · Grip and tack
Pad shape, mounting method and contact geometry are selected around your substrate and end effector.
Adhesive · Insert · Bonded configurations
DESIGNED FOR SEMICONDUCTOR HANDLING
Choose the surface, material and geometry together.
Evaluate performance under your actual process conditions.
Resistance to sliding during substrate transfer. Match the pad model to the backside surface and motion profile.
Controlled separation during lift-off. Select the tack level for the substrate and release sequence.
Material purity and contact-surface design support clean handling. Confirm particle and residue performance in your application.
Review continuous temperature, short-term exposure and contact conditions when selecting the pad.
Evaluate the material and mounting method against the vacuum, outgassing and process requirements.
CONEPOL® provides a conductive material option for applications with ESD requirements.
Bring your wafer conditions and end-effector requirements.
We will help identify a suitable SurfCon® configuration for evaluation.
RESEARCH & EVALUATION
Material development, surface fabrication and testing support our work on precision handling interfaces. Explore selected facilities and research activities below.
Polymer development and synthesis for engineered contact materials.
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Microstructure fabrication for the engineered contact surface.
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Physical and chemical analysis of materials and surfaces.
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Dedicated facilities for material processing and handling.
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Test capability for investigating pad and contact behavior.
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Selected publications related to materials and surface engineering.
View image ↗Images show selected facilities and research activities. Evaluation scope is defined for each application.
APPLICATION REVIEW
A suitable configuration starts with the conditions at the contact surface. Tell us about your substrate, its movement and the equipment interface.
Material, size, thickness, mass, backside finish and warpage.
Acceleration, tilt, rotation and the lift-off sequence.
Mounting, pad count, available height, temperature, environment and ESD needs.
You do not need every parameter to start.
Share what you know; we can clarify the remaining conditions together.
