SURFCON® / APPLICATIONS
From wafer transfer to warped-wafer contact and vacuum-assisted handling.
Find the SurfCon® configuration that fits your process.
APPLICATION GUIDE
Select a starting configuration, then evaluate it with your actual substrate and equipment.
For robotic wafer handling where lateral movement and release behavior both matter.
Flat contact pads with adhesive, insert or bonded integration.
EVALUATEBackside finish, acceleration profile, contact load and lift-off sequence.
For concave or convex wafers that require an appropriate contact geometry.
Dome geometry, or flat pads with sufficient height relative to the wafer warpage.
EVALUATEWarpage range, pad height, contact position and substrate deformation.
For applications where vacuum suction is part of the handling method.
SurfCon® DONUT or vacuum cup configurations matched to the suction interface.
EVALUATEVacuum level, sealing geometry, contact area and backside cleanliness.
POLMA® for insulative configurations. CONEPOL® for applications requiring a conductive material.
Compare material options ↗APPLICATION AREAS
Explore substrate and equipment examples. The right pad depends on the permitted contact area, surface condition and handling task.
Review focusBackside finish, contact load and release sequence.
Review focusBackside finish, contact load and release sequence.
Review focusPermitted contact zones and surface cleanliness.
Review focusPanel dimensions, flatness and contact placement.
Review focusSubstrate flatness, contact stress and surface cleanliness.
Review focusSurface finish, permitted contact area and release behavior.
Review focusAcceleration, rotation and resistance to sliding.
Review focusObject geometry, contact force and pad attachment.
Illustrative application images. Suitability is assessed for each substrate, contact surface and operating condition.
FROM APPLICATION TO EVALUATION
A suitable pad is selected around the substrate and equipment, then evaluated under the actual operating conditions.
Substrate dimensions, backside finish, warpage, temperature, ESD needs and end-effector geometry.
Consider material, mounting method, pad height and contact geometry when selecting an evaluation pad.
Check slip, release behavior, contact cleanliness and durability with the actual substrate and equipment.
Share confirmed values and available drawings.
Unknown conditions can be clarified with our team.
